Characteristics:
The chemical composition of the material is accurately controlled , and its properties are very steady. The grain of the material is compact and well distributed. The back wave of UT is more than 5 times. There are hardly any defects like crack, slag in the material. The copper base made by the above process has no stress after heat treatment and hardly gets out of shape after machining.
Technological process:
Vacuum smelting--Vacuum casting-- Chemical composition analysis-- hoting forging-- solution treatment-- cold forging--again treatment-- machining-- inspection --packing
Thickness plate: Th≥40mm*W≤120mm*L
Thin plate:Th(1-10mm)*W(≤400MM)*L
Th(10-40mm)*W(≤400MM)*L
Audited Supplier 
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